Semiconductor

Maximizing Innovation and ROI

The semiconductor industry is being reshaped by a perfect storm of consolidation and innovation. To remain competitive while navigating market and technology uncertainties, every chip company—whether innovating around GHz, acceleration, power, functionality, even experience—is stretching R&D dollars further than ever.

Aricent helps semiconductor companies achieve the highest ROI on their R&D spend by maximizing the productivity and innovation capacity of in-house R&D teams, reducing engineering costs and improving time-to-market. Offerings include:

  • High-quality engineering services for silicon, systems/boards, platforms, software and product
  • IC design and validation from the most advanced technology nodes to mature, proven processes
  • End-to-end solutions for derivative and legacy chips
  • User-centered experience design for embedded applications
  • Evaluating requirements for embedded vision, machine learning, big data, analytics, cloud, security and other leading-edge technologies
  • Flexible engagements and business models
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Aricent is an engineering services partner to 17 of the world’s top 20 chip makers, ranked #1 in both Semiconductor and Experience Engineering technology segments by Zinnov (2016), and home to the world’s largest VLSI engineering services team.

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Our Services

Aricent is a leading provider of design and engineering services, solutions and frameworks for the semiconductor industry. A comprehensive services portfolio supports end-to-end design and development, testing, deployment and lifecycle support for silicon, boards, platforms, embedded software, applications, product ecosystem and more.

Some of our services include:

DESIGN STRATEGY AND CUSTOMER EXPERIENCE

Services to plan, design and implement the end-to-end customer journey for new embedded products and explore opportunities to create value by monetizing product data and analytics.

SILICON ENGINEERING

Design, implementation and testing services for core processor ICs, embedded SoCs, SIPs, GPUs, DSPs, FPGAs and more—from design to tape-out to post-silicon validation.

SYSTEM/BOARD ENGINEERING

Design, build, test and manufacturing support services for developing boards and hardware platforms.

PLATFORM SOFTWARE AND SERVICES

Software and services for hardware bring-up and to ready ICs and boards for embedded software development.

MIDDLEWARE

Development, integration and testing services of middleware components to support target applications, including application frameworks, APIs, multimedia and display protocols, embedded device

management and more.

NETWORKING AND CONNECTIVITY PROTOCOLS

Integration services for a wide range of industry-standard protocols including wired and wireless connectivity, IP connectivity, Ethernet networking, device management, common industrial protocols and more.

EMBEDDED APPLICATION DEVELOPMENT

Development, enhancement, maintenance and OS-migration services for application software in embedded devices and supporting mobile, web, desktop and cloud apps.

TEST AND VALIDATION

Comprehensive testing services to accelerate delivery of high-quality semiconductor products and services including silicon, boards, platforms, software, end products and more

MAINTENANCE, SUPPORT, VALUE ENGINEERING

Comprehensive post-development services to deploy, maintain and support any IC generation and extend the life and value of mature IC products.

SOFTWARE BUILDING BLOCKS

A large portfolio of frameworks, IP, platforms and development kits to expedite development of core functionality such as connectivity, networking, IoT, security, cloud applications and more.

SOLUTIONS FOR DERIVATIVE AND LEGACY CHIPS

End-to-end design, development, test, deployment, maintenance and support for derivative IC generations. Complete maintenance and support to extend the life and business value of legacy IC generations.

PROCESS MIGRATION

End-to-end design, implementation and testing services to migrate existing silicon and/or IP to new process nodes.

Our Differentiation

  • Complete breadth of product engineering services and solutions to achieve the highest ROI across the semiconductor lifecycle
  • World’s largest VLSI services workforce with experience and expertise in SoC geometries down to 7nm
  • Ranked #1 in Semiconductor technology segment in Zinnov Zones-2016 report; engineering services partner to 17 of the world’s top 20 semiconductor companies
  • End-to-end silicon, system and software services under one roof
  • Experience design services to ensure customers connect with end products both functionally and intuitively
  • Seamless, global delivery model built for agility, quality and speed
  • Flexible engagement and business models
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